PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Verified Import Database of Vietnam Imports from Japan.
| Date | HS Code | Product Description | ORIGIN COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-16 00:00:00 | 74101200 | 7644329#&Copper foil C5210-H-HP-0.06TX16.0W, thickness 0.06mm, copper alloy rolls, not backed, used for the production of electronic components. | Japan | Tien S Inland Port AuthorityHeyn | 1022.5 | KGM | 17137.1 | Importer Name |
| 2024-04-17 00:00:00 | 32141000 | 500060100900000#&Plastic sealant, used in electronics industry ADHESIVE KE-445T | Japan | Long Binh Export Processing Zone Headquarters | 1320 | MLT | 33 | Importer Name |
| 2024-04-17 00:00:00 | 32151190 | 1620037B#&Black printing ink APB-300-32RD (1 set = 2 cans (1 kg) including 1 can (0.65 kg) APB-300-32RD and 1 can (0.35 kg) APBA-300-32RD, used for printing electronic ciruit boar | Japan | CCHQ Bac Thang Long Industrial Park | 70 | KGM | 9027.9 | Importer Name |
| 2024-04-17 00:00:00 | 32151990 | 05020110#&Printing ink used for printing on electronic circuit boards 1 Set = 4 Kg, including PSR-4000 AM03TS and CA-40 AM03TM. 100% New | Japan | Hoa Lac Headquarters | 270 | SET | 17409.6 | Importer Name |
| 2024-04-17 00:00:00 | 35069190 | Adhesive made from epoxy resin TS-1855, 1 tube = 18g, used in the production of electronic components, 100% new | Japan | Ben Luc Headquarters | 24 | PCE | 292.728 | Importer Name |
| 2024-04-17 00:00:00 | 35069190 | Adhesive made from epoxy resin 84-1LMISR4(5CC), 1 tube = 18g, used in the production of electronic components, 100% new | Japan | Ben Luc Headquarters | 2 | PCE | 163 | Importer Name |
| 2024-04-17 00:00:00 | 35069900 | TX AE-421D# & AE-421D glue, 14g/bottle, solid form used to attach electronic components. 100% new product. | Japan | Vinh Phuc Headquarters | 200 | UNA | 6647.2 | Importer Name |
| 2024-04-17 00:00:00 | 38101000 | 38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001 | Japan | Ha Nam Headquarters | 85 | KGM | 7334.650000000001 | Importer Name |
| 2024-04-17 00:00:00 | 38101000 | 38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031 | Japan | Ha Nam Headquarters | 120 | KGM | 9994.800000000001 | Importer Name |
| 2024-04-17 00:00:00 | 38101000 | FY097#&Lead-free solder paste (S3X70-M500 SOLDER PASTE solder paste includes: 1. Tin 82-88% (7440-31-5), 2. Silver 2-3% (7440-22-4).. .,500G/bottle) used to connect components to electronic circuit boards,591.00054.005 | Japan | CCHQ Management of Bac Giang Industrial Parks | 20 | KGM | 2131 | Importer Name |