PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Electronics Import Data of Vietnam by HS Code 381010 for Vietnam Imports from Japan. Our Vietnam Import Customs data and Vietnam Import Data By Country or HS code Include HS code, date, Value, Product Description, Loading and Unloading Ports, Vietnam Importer/Exporter Name, Quantity, etc.
| Date | HS Code | Product Description | ORIGIN COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-17 00:00:00 | 38101000 | 38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001 | Japan | Ha Nam Headquarters | 85 | KGM | 7334.650000000001 | Importer Name |
| 2024-04-17 00:00:00 | 38101000 | 38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031 | Japan | Ha Nam Headquarters | 120 | KGM | 9994.800000000001 | Importer Name |
| 2024-04-17 00:00:00 | 38101000 | FY097#&Lead-free solder paste (S3X70-M500 SOLDER PASTE solder paste includes: 1. Tin 82-88% (7440-31-5), 2. Silver 2-3% (7440-22-4).. .,500G/bottle) used to connect components to electronic circuit boards,591.00054.005 | Japan | CCHQ Management of Bac Giang Industrial Parks | 20 | KGM | 2131 | Importer Name |
| 2024-04-19 00:00:00 | 38101000 | 021-1182#&Soldering cream/Solder paste lead-free NP303-ZYA-1 Type 5 (Soldering cream used to produce electronic circuit boards, Cas No:7440-31-5(85.4%),7440-22-4(2.7 %),7440-50-8(0.44%) (*),1pc=1 jar (500gram), 100% new) | Japan | Vietnam Singapore Industrial Park Authority | 160 | PCE | 10192 | Importer Name |
| 2024-04-19 00:00:00 | 38101000 | PCB-SS0000019AA#&Solder paste (solder paste) includes metal and other materials used to solder electronic components onto printed circuit boards, HEE LFM 48W TM-HP, 100% new, type SS0000019AA | Japan | CCHQ KCEP and IP | 80 | KGM | 6585.516 | Importer Name |
| 2024-04-22 00:00:00 | 38101000 | Solder paste LFM-48W NH(IMT) -A 11.5% for soldering electronic circuit boards, TP: Sn CAS 7440-31-5(85.40%), Ag CAS 7440-22-4(2.66%), Cu CAS 7440-50-8 (0.44%), Rosin 8050-09-7(5.75%),... | Japan | CCHQ Top ManagementUh processing | 100 | KGM | 7977 | Importer Name |
| 2024-04-22 00:00:00 | 38101000 | Soldering paste S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 30 | KGM | 2430 | Importer Name |
| 2024-04-22 00:00:00 | 38101000 | Soldering paste S3X58-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | Japan | Tien S Inland Port AuthorityHeyn | 10 | KGM | 752 | Importer Name |
| 2024-04-26 00:00:00 | 38101000 | 38.02000.00HAG#&Preparation for soldering (solder paste) S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to 100% new electronic circuit boards. Code 38.02000.00HAG | Japan | Ha Nam Headquarters | 30 | KGM | 3153 | Importer Name |
| 2024-04-29 00:00:00 | 38101000 | 38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031 | Japan | Ha Nam Headquarters | 90 | KGM | 7496.1 | Importer Name |