PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Vietnam Import Data by HS Code 85429000, for Imports via port Tien Son Inland Port Authority. Our Vietnam Import Customs data and Vietnam Import Data by HS Code or Port Include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Importer/Exporter Name, Quantity, etc.
| Date | HS Code | Product Description | ORIGIN COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-01 00:00:00 | 85429000 | SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 368496 | PCE | 3684.96 | Importer Name |
| 2024-04-01 00:00:00 | 85429000 | SRG52ESL0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SRG52ESL0H01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 535392 | PCE | 8030.88 | Importer Name |
| 2024-04-01 00:00:00 | 85429000 | SWG00AR20B02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SWG00AR20B02), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 235008 | PCE | 4700.16 | Importer Name |
| 2024-04-01 00:00:00 | 85429000 | SH780AX30H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; SH780AX30H02), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 188808 | PCE | 4531.392 | Importer Name |
| 2024-04-01 00:00:00 | 85429000 | SRG52AR50B01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SRG52AR50B01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 78336 | PCE | 2193.408 | Importer Name |
| 2024-04-01 00:00:00 | 85429000 | SRG55DSE0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SRG55DSE0H01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 213225 | PCE | 5970.3 | Importer Name |
| 2024-04-01 00:00:00 | 85429000 | SXG47CHG0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SXG47CHG0001, CSP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 1224258 | PCE | 36727.74 | Importer Name |
| 2024-04-01 00:00:00 | 85429000 | SR806DX20H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; (SR806DX20H02), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 165072 | PCE | 5612.448 | Importer Name |
| 2024-04-01 00:00:00 | 85429000 | SWG42AXU0H01#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SWG42AXU0H01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 1341685 | PCE | 49642.345 | Importer Name |
| 2024-04-01 00:00:00 | 85429000 | SWG76ME60001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SWG76ME60001, CSP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 210270 | PCE | 7990.26 | Importer Name |