PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Vietnam Import Data by HS Code 85429000, for Vietnam Imports from Korea-republic via port Tien Son Inland Port Authority. Our Vietnam Import Customs data and Vietnam Import Data by HS Code, Country, or Port Include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Importer/Exporter Name, Quantity, etc.
| Date | HS Code | Product Description | ORIGIN COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-02 00:00:00 | 85429000 | NL04#&Camera's infrared circuit board, assembled electronic components SMT VF2_S3L-1-R1 (DTI). CDMDSD from line item number 7 account 104957576030/E31. 100% New | Korea (Republic) | Tien Son Inland Port Authority | 20 | PCE | 762.2 | Importer Name |
| 2024-04-02 00:00:00 | 85429000 | NL04#&Infrared camera board, assembled electronic components SMT VD11_S5L-1-R1*03902706*. CDMDSD from line item number 5 account 106079808920/E31. 100% New | Korea (Republic) | Tien Son Inland Port Authority | 1 | PCE | 47 | Importer Name |
| 2024-04-02 00:00:00 | 85429000 | WHG52AS40000#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(RND): WHG52AS40000), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 159336 | PCE | 3346.056 | Importer Name |
| 2024-04-02 00:00:00 | 85429000 | WX718CBW0000#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(RND): WX718CBW0000), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 62008 | PCE | 3782.488 | Importer Name |
| 2024-04-02 00:00:00 | 85429000 | XX718CBW0000#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(RND): XX718CBW0000), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 18872 | PCE | 1151.192 | Importer Name |
| 2024-04-02 00:00:00 | 85429000 | SWG42MXF0H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; SWG42MXF0H02, WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 224784 | PCE | 4046.112 | Importer Name |
| 2024-04-02 00:00:00 | 85429000 | SX806AZYR001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SX806AZYR001, CSP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 15628 | PCE | 562.608 | Importer Name |
| 2024-04-02 00:00:00 | 85429000 | SR942AX70H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SR942AX70H01), WLP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 145224 | PCE | 5663.736 | Importer Name |
| 2024-04-02 00:00:00 | 85429000 | SX725AHR0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SX725AHR0001, CSP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 485760 | PCE | 65091.84 | Importer Name |
| 2024-04-02 00:00:00 | 85429000 | SQG47AUR0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); Thickness 350um(+-)10um, SQG47AUR0001, CSP process, 100% new | Korea (Republic) | Tien Son Inland Port Authority | 111540 | PCE | 16954.08 | Importer Name |