PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Semiconductor Export Data of Vietnam under HS Code 854290, for Vietnam Exports to Korea-republic via port Tien S Inland Port Authorityheyn. Our Vietnam Export Customs data by HS Code, Country, or Port includes HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Exporter/Importer Name, Quantity, etc.
| Date | HS Code | Product Description | DESTINATION COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-15 00:00:00 | 85429000 | SHG56AF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56AF30001, CSP process, 100% new TX 1 part DH 4 TK 106172762510/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 202 | PCE | 1.616 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG56BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56BA00001, CSP process, 100% new TX 1 part DH 4 TK 105921068960/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 1893 | PCE | 15.144 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SDG45EA40001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SDG45EA40001, CSP process, 100% new TX 1 part DH 1 TK 106134136030/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 89462 | PCE | 805.158 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SH806BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SH806BA00001, CSP process, 100% new TX 1 part DH 9 TK 106134136030/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 21957 | PCE | 197.613 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG89BF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG89BF30001, CSP process, 100% new TX 1 part DH 8 TK 106124093610/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 140278 | PCE | 1262.502 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 13151 | PCE | 131.51 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 40944 | PCE | 409.44 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG93BA40001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG93BA40001, CSP process, 100% new TX 1 part DH 16 TK 106118747600/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 240662 | PCE | 2406.62 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SDG35BGN0001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SDG35BGN0001, CSP process, 100% new TX 1 part DH 1 Account 106150630350/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 55095 | PCE | 606.045 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG93AXQ0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG93AXQ0H01), WLP process, 100% new TX 1 part DH 40 TK 106118747600/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 56579 | PCE | 678.948 | Importer Name |