PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Semiconductor Export Data of Vietnam under HS Code 85, for Vietnam Exports to Korea-republic via port Tien S Inland Port Authorityheyn. Our Vietnam Export Customs data by HS Code, Country, or Port includes HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Exporter/Importer Name, Quantity, etc.
| Date | HS Code | Product Description | DESTINATION COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-17 00:00:00 | 85340090 | MG41W2016BD#&Printed circuit board has printed electrical paths but has not yet installed other semiconductor devices (PCB; 2016, SFML1A0Z0_Rev2.0), MG41W2016BD, 100% new product TX 1 part DH 3 TK 106192971950/E11#&JP | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 501371 | PCE | 7505.52387 | Importer Name |
| 2024-04-26 00:00:00 | 85369094 | PD10762#&Pogo pin conductive contact pin S026-3.75-ZPO15-ST64R9919.1 used to install into semiconductor electrical performance tester; voltage 12V; Current intensity 1.5-2A#&KXD | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 24535 | PCE | 5041.20645 | Importer Name |
| 2024-04-26 00:00:00 | 85369094 | PD10272#&Pogo pin conductive contact pin DSP042-3.2-AM20H25GLH is used to install into a semiconductor electrical performance tester; voltage 12V; Current intensity 1.5-2A #&KXĐ | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 17147 | PCE | 3523.19409 | Importer Name |
| 2024-04-26 00:00:00 | 85411000 | Surveillance camera board semiconductor diode. 100% new product #&CN | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 500 | PCE | 191 | Importer Name |
| 2024-04-26 00:00:00 | 85415900 | Photosensitive semiconductor device of surveillance camera. 100% new item#&JP | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 48 | PCE | 403.2 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG56AF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56AF30001, CSP process, 100% new TX 1 part DH 4 TK 106172762510/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 202 | PCE | 1.616 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG56BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56BA00001, CSP process, 100% new TX 1 part DH 4 TK 105921068960/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 1893 | PCE | 15.144 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SDG45EA40001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SDG45EA40001, CSP process, 100% new TX 1 part DH 1 TK 106134136030/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 89462 | PCE | 805.158 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SH806BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SH806BA00001, CSP process, 100% new TX 1 part DH 9 TK 106134136030/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 21957 | PCE | 197.613 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG89BF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG89BF30001, CSP process, 100% new TX 1 part DH 8 TK 106124093610/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 140278 | PCE | 1262.502 | Importer Name |