PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Vietnam Export Data by HS Code 85429000, for Vietnam Exports to Korea-republic via port Tien S Inland Port Authorityheyn. Our Vietnam Export Customs data and Vietnam Export Data by HS Code, Country, or Port Include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Exporter/Importer Name, Quantity, etc.
| Date | HS Code | Product Description | DESTINATION COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-05 00:00:00 | 85429000 | Electronic chip on the circuit board of the surveillance camera. 100% new product#&VN | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 1200 | PCE | 450 | Importer Name |
| 2024-04-12 00:00:00 | 85429000 | SP3330D#&Battery dedicated electronic circuit part, Model SP3330D. 100% new product#&VN | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 255 | PCE | 292.4085 | Importer Name |
| 2024-04-12 00:00:00 | 85429000 | Camera's infrared circuit board, electronic components assembled. 100% new product #&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 10 | PCE | 303.37 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG56AF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56AF30001, CSP process, 100% new TX 1 part DH 4 TK 106172762510/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 202 | PCE | 1.616 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG56BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56BA00001, CSP process, 100% new TX 1 part DH 4 TK 105921068960/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 1893 | PCE | 15.144 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SDG45EA40001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SDG45EA40001, CSP process, 100% new TX 1 part DH 1 TK 106134136030/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 89462 | PCE | 805.158 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SH806BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SH806BA00001, CSP process, 100% new TX 1 part DH 9 TK 106134136030/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 21957 | PCE | 197.613 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG89BF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG89BF30001, CSP process, 100% new TX 1 part DH 8 TK 106124093610/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 140278 | PCE | 1262.502 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 13151 | PCE | 131.51 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 40944 | PCE | 409.44 | Importer Name |