PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Vietnam Export Data by HS Code 854290, for Vietnam Exports to Korea-republic via port Cua-viet-port-ck-customs-branch. Our Vietnam Export Customs data and Vietnam Export Data by HS Code, Country, or Port Include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Exporter/Importer Name, Quantity, etc.
| Date | HS Code | Product Description | DESTINATION COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-05 00:00:00 | 85429000 | Electronic chip on the circuit board of the surveillance camera. 100% new product#&VN | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 1200 | PCE | 450 | Importer Name |
| 2024-04-12 00:00:00 | 85429000 | SP3330D#&Battery dedicated electronic circuit part, Model SP3330D. 100% new product#&VN | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 255 | PCE | 292.4085 | Importer Name |
| 2024-04-12 00:00:00 | 85429000 | Camera's infrared circuit board, electronic components assembled. 100% new product #&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 10 | PCE | 303.37 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG56AF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56AF30001, CSP process, 100% new TX 1 part DH 4 TK 106172762510/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 202 | PCE | 1.616 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG56BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG56BA00001, CSP process, 100% new TX 1 part DH 4 TK 105921068960/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 1893 | PCE | 15.144 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SDG45EA40001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SDG45EA40001, CSP process, 100% new TX 1 part DH 1 TK 106134136030/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 89462 | PCE | 805.158 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SH806BA00001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SH806BA00001, CSP process, 100% new TX 1 part DH 9 TK 106134136030/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 21957 | PCE | 197.613 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG89BF30001#&Semiconductor wafer assembly used in semiconductor chip manufacturing technology (CHIP); thickness 350um(+-)10um, SHG89BF30001, CSP process, 100% new TX 1 part DH 8 TK 106124093610/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 140278 | PCE | 1262.502 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 13151 | PCE | 131.51 | Importer Name |
| 2024-04-15 00:00:00 | 85429000 | SHG60AXN0H01#&Semiconductor wafer used in semiconductor chip manufacturing technology (WAFER(FAB): SHG60AXN0H01), WLP process, 100% new TX 1 part DH 38 TK 106118747600/E11#&KR | Korea (Republic) | Tien S Inland Port AuthorityHeyn | 40944 | PCE | 409.44 | Importer Name |