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Vietnam Import Data Under HS Code 848610 for Imports via port Cchq-dien-nam-dien-ngoc-industrial-park

Live Vietnam Import Data by HS Code 848610, for Imports via port Cchq-dien-nam-dien-ngoc-industrial-park. Our Vietnam Import Customs data and Vietnam Import Data by HS Code or Port Include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Importer/Exporter Name, Quantity, etc.

List Of Vietnam Import Data Under HS Code 848610 Via Port Cchq-dien-nam-dien-ngoc-industrial-park

Table View Graphical View
Date
HS Code
Product Description
ORIGIN COUNTRY
Custom Name
QTY.UNITValue($)Importer Name
2024-04-16 00:00:0084861090
MM-P99223002790#&Wafer automatic component assembly equipment, used to produce wafer semiconductor panels, BONDER 6FA-S, model AHF-016, brand KIT, voltage 220V, year of manufacture 2024, product 100% new
Korea (Republic)CCHQ Ha Nam1SET85532

Importer Name

2024-04-22 00:00:0084861090
JM09#&Semiconductor heatsink, size 19.3x7.2mm Heat sink HS2;AL1050;;19.3+7.2P20mm;2.0mm;PCB1138;0 3130090973 power adapter sx
ChinaCCHQ Ha Nam650PCE16.29225

Importer Name

2024-04-22 00:00:0084861090
JM09#&Semiconductor heatsink, size 19.5x8mm Heat sink HS1-A;;AL1050;;19.5+8P 20mm;2.0mm;PCB1138;0 3130090971 power adapter sx
ChinaCCHQ Ha Nam535PCE13.60986

Importer Name

2024-04-02 00:00:0084861040
Dicing machine, 3 phase AC 380V, 50/60Hz, capacity under 3KW, model J5060-2 used to cut thin semiconductor wafers into molecular chips in the module panel of the water filter, manufactured in 2016, used goods,
ChinaCCHQ Management of Industrial Parks in Bac Giang1PCE1127.4

Importer Name

2024-04-02 00:00:0084861040
Dicing machine, 3 phase AC 380V, 50/60Hz, capacity under 3KW, model B5060C-2 used to cut thin semiconductor wafers into molecular chips in water filter module panels, manufactured in 2016, used goods, Producer BOHYUNTEM
ChinaCCHQ Management of Industrial Parks in Bac Giang1PCE1127.4

Importer Name

2024-04-02 00:00:0084861040
Dicing machine, 3 phase AC 380V, 50/60Hz, capacity under 3KW, model B5060C-2 used to cut thin semiconductor wafers into molecular chips in module panels of water purifiers, manufactured in 2016, used goods, Producer BOHYUNTEM
ChinaCCHQ Management of Industrial Parks in Bac Giang1PCE1127.4

Importer Name

2024-04-02 00:00:0084861040
Dicing machine, 3 phase AC 380V, 50/60Hz, capacity under 3KW, model B5060C-2 used to cut thin semiconductor wafers into molecular chips in water filter module panels, manufactured in 2016, used goods, Producer BOHYUNTEM
ChinaCCHQ Management of Industrial Parks in Bac Giang1PCE1127.4

Importer Name

2024-04-02 00:00:0084861040
Dicing machine, 3 phase AC 380V, 50/60Hz, capacity under 3KW, model B7080C-1 used to cut thin semiconductor wafers into molecular chips in module panels of water purifiers, manufactured in 2016, used goods, Producer BOHYUNTEM
ChinaCCHQ Management of Industrial Parks in Bac Giang1PCE1127.4

Importer Name

2024-04-04 00:00:0084861090
.#&Semiconductor silicon wafer cleaning equipment (circular), electrically operated acid, model: R19180GL, cs: 275 KW, voltage: 380V/50Hz, Manufacturer: Hunan Rising Automation Equipment Co., ltd;year production: 2024; 100% new
ChinaCCHQ Vinh1SET267409.47

Importer Name

2024-04-09 00:00:0084861090
.#&Single crystal silicon slicer (using cutting knife, equipment using semiconductor block production), model: GC-800X, capacity: 150KVA, voltage 380V, manufacturer: Qingdao Gaoce Technology Co.,Ltd , new 100%
ChinaCCHQ Vinh4SET600808

Importer Name

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