PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Vietnam Import Data by HS Code 39209990, for Vietnam Imports from Korea-republic via port Cchq Kcep And Ip. Our Vietnam Import Customs data and Vietnam Import Data by HS Code, Country, or Port Include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Importer/Exporter Name, Quantity, etc.
| Date | HS Code | Product Description | ORIGIN COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-05 00:00:00 | 39209990 | Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new | Korea (Republic) | CCHQ KCEP and IP | 3168 | MTR | 19103.04 | Importer Name |
| 2024-04-09 00:00:00 | 39209990 | Epoxy resin, polyimide Film, rolls used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200K N 2530 S 500, 56um thick, 0.5m wide, manufactured by DOOSAN, new 100% | Korea (Republic) | CCHQ KCEP and IP | 4000 | MTR | 24200 | Importer Name |
| 2024-04-22 00:00:00 | 39209990 | ST-CP4055P(0.07T) film made of Polyolefin plastic, non-porous and unreinforced, not bonded with other materials, dimension: 930mm*200m, thickness: 0.07mm, used in electronic components production. New 100% | Korea (Republic) | CCHQ KCEP and IP | 3720 | MTK | 14991.6 | Importer Name |
| 2024-04-19 00:00:00 | 39209990 | Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new | Korea (Republic) | CCHQ KCEP and IP | 6800 | MTR | 41004 | Importer Name |
| 2024-04-09 00:00:00 | 39209990 | PFDS005CF01#&Film, size: 1080mm*1000M*0.05T, 100% new | Korea (Republic) | CCHQ KCEP and IP | 3240 | MTK | 3985.2 | Importer Name |
| 2024-04-11 00:00:00 | 39209990 | Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new | Korea (Republic) | CCHQ KCEP and IP | 6800 | MTR | 41004 | Importer Name |
| 2024-04-15 00:00:00 | 39209990 | ST-CP4055P(0.07T) film made of Polyolefin plastic, non-porous and unreinforced, not bonded with other materials, dimension: 350mm*200m, thickness: 0.07mm, used in electronic components production. New 100% | Korea (Republic) | CCHQ KCEP and IP | 420 | MTK | 1692.6 | Importer Name |
| 2024-04-01 00:00:00 | 39209990 | Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new | Korea (Republic) | CCHQ KCEP and IP | 6800 | MTR | 41004 | Importer Name |
| 2024-04-22 00:00:00 | 39209990 | Epoxy resin, polyimide Film, rolls used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 500, 56um thick, 0.5m wide, manufactured by DOOSAN, new 100% | Korea (Republic) | CCHQ KCEP and IP | 257 | MTR | 1359.53 | Importer Name |
| 2024-04-03 00:00:00 | 39209990 | Epoxy resin, polyimide Film, roll form used to bond circuit board layers (non-porous type used to increase the hardness of FPCB products), code DPF-200 N 2535 S 516, 60 um thick, 0.516m wide, nsx DOOSAN, 100% new | Korea (Republic) | CCHQ KCEP and IP | 6800 | MTR | 41004 | Importer Name |