PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Vietnam Import Data by HS Code 38109000, for Vietnam Imports from Japan via port Vietnam Singapore Industrial Park Authority. Our Vietnam Import Customs data and Vietnam Import Data by HS Code, Country, or Port Include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Importer/Exporter Name, Quantity, etc.
| Date | HS Code | Product Description | ORIGIN COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-16 00:00:00 | 38109000 | J03922#&Surface cleaner mixture K. type (integrated circuit surface rust removal before Ni plating) - TOPRIP BT-200 [HNO3 23%, CAS7697-37-2; CH3CH(OH)CH3 1.4%, CAS67-63-0]. Item:7 KBHC: HC2024466698 | Japan | Vietnam Singapore Industrial Park Authority | 2000 | LTR | 7254.62 | Importer Name |
| 2024-04-23 00:00:00 | 38109000 | 0171-2#&Metal surface cleaning agent mixture - GLICOAT - SMND F2 (LX) [contains TCCN: CH3COOH 9.9%, CAS 64-19-7]. Section 15 GPNK 14431/GP-HC (December 29, 2023) | Japan | Vietnam Singapore Industrial Park Authority | 200 | LTR | 2099.81 | Importer Name |
| 2024-04-09 00:00:00 | 38109000 | B59#&Solder paste used to bond electronic components-Solder paste (M705-235C-21-11.5), CAS Code:7440-31-5; 7440-22-4; 7440-50-8 | Japan | Vietnam Singapore Industrial Park Authority | 10000 | GRM | 722 | Importer Name |
| 2024-04-09 00:00:00 | 38109000 | B59#&Solder paste used to bond electronic components-Solder paste (M705-SHF), CAS Code:7440-31-5; 7440-22-4; 7440-50-8 | Japan | Vietnam Singapore Industrial Park Authority | 10000 | GRM | 501 | Importer Name |
| 2024-04-02 00:00:00 | 38109000 | 0171-2#&Metal surface cleaning agent mixture - GLICOAT - SMND F2 (LX) [contains TCCN: CH3COOH 9.9%, CAS 64-19-7]. Section 15 GPNK 14431/GP-HC (December 29, 2023) | Japan | Vietnam Singapore Industrial Park Authority | 400 | LTR | 4203.816 | Importer Name |
| 2024-04-02 00:00:00 | 38109000 | J03922#&K.type surface cleaning agent mixture (integrated circuit surface rust removal before Ni plating) - TOPRIP BT-200 [HNO3 23%, CAS7697-37-2; CH3CH(OH)CH3 1.4%, CAS67-63-0]. Section: 7 KBHC: HC2024462294(April 1, 2024) | Japan | Vietnam Singapore Industrial Park Authority | 2600 | LTR | 10792.288 | Importer Name |
| 2024-04-11 00:00:00 | 38109000 | CS-PHOSNIN259ERK#&Chemical (removes oil on KL surface)phosnin 259ER-K(17Kg/can),(CAS:67-63-0(25%),7632-00-0(1.5%),polyoxyalkylene alkyl ether (25%)),(KBHC:HC2024465166),(No further input into production process) | Japan | Vietnam Singapore Industrial Park Authority | 272 | KGM | 1145.7592 | Importer Name |
| 2024-04-24 00:00:00 | 38109000 | B59#&Solder paste used to bond electronic components-Solder paste (M705-235C-21-11.5), CAS Code:7440-31-5; 7440-22-4; 7440-50-8 | Japan | Vietnam Singapore Industrial Park Authority | 10000 | GRM | 722 | Importer Name |
| 2024-04-24 00:00:00 | 38109000 | B59#&Solder paste used to bond electronic components (M705-NXC400ZH-T6K), (CAS Code:7440-31-5,CAS:7440-22-4,CAS:7440-50-8) | Japan | Vietnam Singapore Industrial Park Authority | 20000 | GRM | 1426 | Importer Name |
| 2024-04-24 00:00:00 | 38109000 | J04276#&Solder paste, brand NIHON FILLER METALS, model: CS/PBF111-WA11-ND189 20-38, used for solder plating process to produce integrated circuits CIS - Solder Paste | Japan | Vietnam Singapore Industrial Park Authority | 80 | KGM | 9802.5608 | Importer Name |