PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Electronics Import Data of Vietnam by HS Code 38101000 via port Ha Nam Headquarters. Our Vietnam 38101000 Customs data and Vietnam 38101000 Data by HS Code or port include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Importer/Exporter Name, Quantity, etc.
| Date | HS Code | Product Description | ORIGIN COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-17 00:00:00 | 38101000 | KHT#&CLEAN SOLDER CREAM NP303 COSMO ZQ-C 500G solder paste, for soldering components onto electronic circuit boards, TP: Sn(7440-31-5),AG(7440-22-4), CU(7440-50 -8), item 1 Account: 106198110542. 100% new. Code 2103ZZS00001 | Malaysia | Ha Nam Headquarters | 130 | KGM | 11245 | Importer Name |
| 2024-04-17 00:00:00 | 38101000 | 38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001 | Japan | Ha Nam Headquarters | 85 | KGM | 7334.650000000001 | Importer Name |
| 2024-04-17 00:00:00 | 38101000 | 38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031 | Japan | Ha Nam Headquarters | 120 | KGM | 9994.800000000001 | Importer Name |
| 2024-04-22 00:00:00 | 38101000 | D4950000017#&Solder paste M705-GRN360-K2-V (500g/bottle), used to solder electronic components onto circuit boards, ingredients Sn 96.5%, Ag 3%, Cu 0.5%. New 100% | Korea (Republic) | Ha Nam Headquarters | 20 | KGM | 2017.23 | Importer Name |
| 2024-04-26 00:00:00 | 38101000 | A303000124-1#&Solder paste SnBi30Cu0.5, medium melting temperature, used in the production of electronic components, 100% new | China | Ha Nam Headquarters | 1000 | KGM | 35710 | Importer Name |
| 2024-04-26 00:00:00 | 38101000 | 38.02D68.001#&Soldering preparation (solder paste) KOKI S3X70-M500, 500G/Bottle (TP: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards Electronic, 100% new. Code 38.02D68.001 | China | Ha Nam Headquarters | 320 | KGM | 33632 | Importer Name |
| 2024-04-26 00:00:00 | 38101000 | 38.02000.00HAG#&Preparation for soldering (solder paste) S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to 100% new electronic circuit boards. Code 38.02000.00HAG | Japan | Ha Nam Headquarters | 30 | KGM | 3153 | Importer Name |
| 2024-04-29 00:00:00 | 38101000 | 38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031 | Japan | Ha Nam Headquarters | 90 | KGM | 7496.1 | Importer Name |
| 2024-04-02 00:00:00 | 38101000 | A303000124-1#&Solder paste SnBi30Cu0.5, medium melting temperature, used in the production of electronic components, 100% new | China | Ha Nam Headquarters | 700 | KGM | 22218 | Importer Name |
| 2024-04-04 00:00:00 | 38101000 | 99CHEM000272G#&Solder paste S3X58-M500L, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to electronic circuit boards. New 100% | China | Ha Nam Headquarters | 100000 | GRM | 9400 | Importer Name |