Live Vietnam Import Data by HS Code 38101000, for Vietnam Imports from Japan via port Ha-nam-headquarters. Our Vietnam Import Customs data and Vietnam Import Data by HS Code, Country, or Port Include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Importer/Exporter Name, Quantity, etc.
04-Apr-24
38101000
NVL19#&Lead-free solder paste LFM-48W SSK-V, ingredients include Sn (7440-31-5), Ag (7440-22-4), Cu (7440-50-8), Rosin (8050-09-7 ). 0.5 KG/1 CAN. Used for soldering. New 100%.
Japan
Ha Nam Headquarters
10
KGM
978.2488999999999
Importer Name
04-Apr-24
38101000
38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%, ...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001
Japan
Ha Nam Headquarters
10
KGM
862.9000000000001
Importer Name
04-Apr-24
38101000
38.01358.001#&Preparation for soldering (solder paste) S3X58-A340, 0.5kg/bottle (Content: Tin 82-88%, silver 2-3%, .), used to connect components to circuit boards 100% new, brand new. Code 38.01358.001
Japan
Ha Nam Headquarters
35
KGM
2915.15
Importer Name
08-Apr-24
38101000
KHT# & LFM-48X Soldering Paste TM 11.5%, CAS TP: 7440-31-5, 7440-22-4, 7440-50-8, 8050-09-7 (item 1 TK 106191102840). New 100%. Code 2103ZZX00006
Japan
Ha Nam Headquarters
20
KGM
2451
Importer Name
09-Apr-24
38101000
7460890 Metal surface treatment preparation, liquid, ingredients with cas code: 7446-08-4, 7664-93-9 (COLORING AGENT) COPPER BLACK NO. 65-F (20KG/UNCAN). New 100%
Japan
Ha Nam Headquarters
360
KGM
4204.8
Importer Name
09-Apr-24
38101000
61V-100-0074R#&Solder paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%, ...) used to connect components to circuit boards electronics, used to produce telecommunications equipment
Japan
Ha Nam Headquarters
400000
GRM
35200
Importer Name
11-Apr-24
38101000
38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%, ...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001
Japan
Ha Nam Headquarters
20
KGM
1725.8
Importer Name
17-Apr-24
38101000
38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%, ...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001
Japan
Ha Nam Headquarters
85
KGM
7334.650000000001
Importer Name
17-Apr-24
38101000
38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, ..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031
Japan
Ha Nam Headquarters
120
KGM
9994.800000000001
Importer Name
17-Apr-24
38101000
38.01358.001#&Preparation for soldering (solder paste) S3X58-A340, 0.5kg/bottle (Content: Tin 82-88%, silver 2-3%, .), used to connect components to circuit boards 100% new, brand new. Code 38.01358.001
Japan
Ha Nam Headquarters
40
KGM
3331.6
Importer Name