PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
PLEASE NOTE: We are NOT A LOGISTICS COMPANY and do NOT BUY, SELL, OR TRADE any products.
Live Vietnam Import Data by HS Code 38101000, for Vietnam Imports from Japan via port Ha Nam Headquarters. Our Vietnam Import Customs data and Vietnam Import Data by HS Code, Country, or Port Include HS code, Date, Value, Product Description, Loading and Unloading Ports, Vietnam Importer/Exporter Name, Quantity, etc.
| Date | HS Code | Product Description | ORIGIN COUNTRY | Custom Name | QTY. | UNIT | Value($) | Importer Name |
|---|---|---|---|---|---|---|---|---|
| 2024-04-17 00:00:00 | 38101000 | 38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001 | Japan | Ha Nam Headquarters | 85 | KGM | 7334.650000000001 | Importer Name |
| 2024-04-17 00:00:00 | 38101000 | 38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031 | Japan | Ha Nam Headquarters | 120 | KGM | 9994.800000000001 | Importer Name |
| 2024-04-09 00:00:00 | 38101000 | 7460890 Metal surface treatment preparation, liquid, ingredients with cas code: 7446-08-4, 7664-93-9 (COLORING AGENT) COPPER BLACK NO. 65-F (20KG/UNCAN). New 100% | Japan | Ha Nam Headquarters | 360 | KGM | 4204.8 | Importer Name |
| 2024-04-04 00:00:00 | 38101000 | NVL19#&Lead-free solder paste LFM-48W SSK-V, ingredients include Sn (7440-31-5), Ag (7440-22-4), Cu (7440-50-8), Rosin (8050-09-7 ). 0.5 KG/1 CAN. Used for soldering. New 100%. | Japan | Ha Nam Headquarters | 10 | KGM | 978.2488999999999 | Importer Name |
| 2024-04-04 00:00:00 | 38101000 | 38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001 | Japan | Ha Nam Headquarters | 10 | KGM | 862.9000000000001 | Importer Name |
| 2024-04-26 00:00:00 | 38101000 | 38.02000.00HAG#&Preparation for soldering (solder paste) S3X70-HF1100-3, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to 100% new electronic circuit boards. Code 38.02000.00HAG | Japan | Ha Nam Headquarters | 30 | KGM | 3153 | Importer Name |
| 2024-04-29 00:00:00 | 38101000 | 38.02MA3.031#&Soldering preparation (solder paste) S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%,..), used to connect components to circuit boards electronics, Koki manufacturer, 100% new, Code 38.02MA3.031 | Japan | Ha Nam Headquarters | 90 | KGM | 7496.1 | Importer Name |
| 2024-04-08 00:00:00 | 38101000 | KHT# & LFM-48X Soldering Paste TM 11.5%, CAS TP: 7440-31-5, 7440-22-4, 7440-50-8, 8050-09-7 (item 1 TK 106191102840). New 100%. Code 2103ZZX00006 | Japan | Ha Nam Headquarters | 20 | KGM | 2451 | Importer Name |
| 2024-04-09 00:00:00 | 38101000 | 61V-100-0074R#&Solder paste S3X58-M406, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to connect components to circuit boards electronics, used to produce telecommunications equipment | Japan | Ha Nam Headquarters | 400000 | GRM | 35200 | Importer Name |
| 2024-04-11 00:00:00 | 38101000 | 38.02358.001#&Preparation for soldering (solder paste) S3X58-M500C-5, 500G/Bottle (Content: Tin 82-88%, silver 2-3%, copper 0.1-1%,...) used to Connecting components to electronic circuit boards, Koki manufacturer. Code 38.02358.001 | Japan | Ha Nam Headquarters | 20 | KGM | 1725.8 | Importer Name |